XRF coating thickness measurement
Non-destructive control of coating thickness and composition — from PCB boards to micro-areas of IC pins.
In electroplating, electronics and connector manufacturing, coating thickness and composition determine product quality and durability. X-ray fluorescence (XRF) measures single and multi-layer coatings without destroying the sample, with high repeatability and no contact with the part.
The range covers different scales: from large PCB boards and enclosures, through complex-shaped parts, to micro-areas of IC pins and wafers, where polycapillary optics and precise positioning are required.
Recommended techniques and instruments
- XRF spectrometers — benchtop coating-thickness analyzers, including EDX-T30 and EDXThick800 for micro-areas.
- EDX-PCB — large travel range for big PCB boards, enclosures and wafers.
- XRF accessories — preparing reference samples and bulk materials.